Monday, June 9, 2008

IBM aims to cool chips with water

The water cooling technology was built into IBM's 3D chips

A network of tiny pipes of water could be used to cool next-generation PC chips, researchers at IBM have said.

Scientists at the firm have shown off a prototype device layered with thousands of "hair-width" cooling arteries.

They believe it could be a solution to the increasing amount of heat pumped out by chips as they become smaller and more densely packed with components. . . more

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