Monday, June 9, 2008
The water cooling technology was built into IBM's 3D chips
A network of tiny pipes of water could be used to cool next-generation PC chips, researchers at IBM have said.
Scientists at the firm have shown off a prototype device layered with thousands of "hair-width" cooling arteries.
They believe it could be a solution to the increasing amount of heat pumped out by chips as they become smaller and more densely packed with components. . . more